The recent trend to portable and wireless on one hand, and commodity prices for cell phones and PCs on the other hand, has brought on the need for much smaller IC and system-level packages that are ...

Still, one of the problems with all advanced packaging is the cost, and companies such as ASE, Powertech, Nepes, and Samsung are looking to panel-level packaging to provide economies of scale. A panel ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Detailed price information for Aehr Test Systems (AEHR-Q) from The Globe and Mail including charting and trades.