TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging ...

A circular cooling rack standing on a wooden surface. - Arina P Habich/Shutterstock A cooling rack is a genius hack for dicing hard-boiled eggs with speed. Cooling racks have a ton of surface area ...

NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time ...

This study fabricates a 45 ± 2° etching-free micro-mirror at the wafer level using dicing and e-beam metal evaporation methods. The root-mean-square (RMS) surface roughness of Au-deposited diced ...