Yunji Corcoran, CEO and chairwoman of SMC Diode Solutions, brings over 30 years of expertise in the power semiconductor industry.In this interview, she shares her remarkable journey, from earning a Ph ...

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Integrated Diamond Cooling, Power Device Packaging, and EUV Lithography! Here’s a RoundUp of this ...

BYD has recently begun using cargo vessels of its own design to ship electric vehicles (EVs) worldwide. BYD Company Limited is a Chinese multinational conglomerate founded in 1995 by a Chinese ...

Researchers continue to optimize packaging technologies to improve the reliability and extend the lifespan of power electronic solutions. Power devices such as MOSFETs, diodes, and transistors require ...

EUV (Extreme Ultraviolet) lithography systems play a vital role in semiconductor manufacturing, facilitating the creation of smaller, more powerful, and energy-efficient chips. EUV (Extreme ...

An updated, practical guide filled with color illustrations on transitioning from silicon to GaN and utilizing GaN power devices and ICs in power conversion system design. Efficient Power Conversion ...

SemiQ has announced the QSiC 1200V MOSFET, the third generation of SiC technology. This most recent version achieves more efficiency but a smaller die size. Over the years, silicon carbide (SiC) ...

The article focuses on an innovative diamond cooling technology developed by Akash Systems that has demonstrated significant advantages over legacy solutions. Diamond is an ultra-wide bandgap ...

200 mm SiC products, manufactured in Villach, Austria, provide first-class SiC power technology for high-voltage applications. Infineon Technologies AG has made remarkable advancements in its 200 mm ...

The Q-DPAK package introduction supports the continued development of Infineon’s new Topside Cooled (TSC) product family. The electronics industry is undergoing a major transformation, driven by the ...