One of the nine Black students who integrated a high school in Arkansas’ capital city in 1957 while a mob of white ...

9月21日，由张江高科、芯谋研究联合主办的张江高科·芯谋研究（第十届）集成电路产业领袖峰会在上海浦东圆满举行。本届峰会为近年来行业里规格最高的国际半导体产业峰会，来自ST、AMD、华为、中芯国际、华虹、华润微、长存、蔚来等知名国际国内企业的300多位 ...

Officers and the ambulance service attended and 16-year-old Deonte Mowatt-Slater was found with a serious injury, the ...

The race is on to implement wafer stacking and die-to-wafer hybrid bonding, now considered essential for stacking logic and memory, 3D NAND, and possibly multi-layer DRAM stacks in HBMs. Vertical ...

目前台积电共有五座先进封测厂，分别位于竹科、中科、南科、龙潭与竹南。其中竹南的AP6于2023年6月正式启用，为台积电首座实现3D Fabric整合前段至后段制程以及测试的全自动化工厂，经过了一年的运营，已成为中国台湾最大的CoWoS封装基地。

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and ...

In a referendum in the former Soviet republic of Moldova, the population has voted by a wafer-thin majority in favor of ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) ...

TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it ...

When properly architected, chiplets provide greater product flexibility, allowing teams to focus on their unique value-add ...

The investment in the construction of India’s first 12-inch wafer fab is expected to reach $11 billion. Credit: PSMC Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of ...