Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.

DXB is designed to bond wafers using WaferGrip Temporary Adhesive. Dynatex International supplies WaferGrip in various preformed shapes and sizes to suit the required application. This along with the ...

According to research firm Astute Analytica, the global push towards digitalization, coupled with rising demand for consumer electronics and miniaturization, is expected to boost the global wafer ...