SiC Based Power Electronics Market is Segmented by Type (SiC MOSFET Modules, SiC MOSFET Discrete, SiC SBD, Others (SiC JFETs & FETs)), by Application (Automotive & EV/HEV, EV Charging, Industrial ...
Ampere, the intelligent electric EV pure player born from Renault Group and STMicroelectronics, a global semiconductor leader ...
Abstract: Power module packaging remains one of the constraints preventing SiC devices from realizing high power density and optimal reliability in converters. This article proposes a non-thermal ...
Abstract: Monitoring bond wire lift-off unevenness is the basis for high reliability operation of multichip silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) power ...
As part of the Automotive EV Traction solutions business unit, he leads the PLM team in the assigned regions and WW activities. The scope is to define and develop a new Si and SiC Power Module and ...
X-FAB Silicon Foundries SE has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power MOSFETs, delivering greatly reduced cell pitch, allowing increased die ...
Porter's five forces analysis illustrates the potency of the buyers and suppliers in the power discrete and modules industry. In terms ...
Some developments have happened. In 2020, a new 1200V silicon carbide (SiC) MOSFET for high power industrial applications was introduced by Toshiba Electronics Europe GmbH. In 2021, ON Semiconductor, ...
The collaboration with Ampere on the silicon carbide power modules and powerbox demonstrates STMicroelectronics’ leadership and system level experience of advanced power electronics, including its ...
Analysis of SiC patents shows the rapid progression of China and the main vertically integrated companies says a report by ...
Mitsubishi Electric will begin shipping samples of two new S1-Series High Voltage IGBT modules, both rated at 1.7kV, for ...
SynQor’s latest defence-grade isolated power conditioning module – MPFICQor – is designed particularly for the demanding needs of airborne applications, such as underwing pods and ordnance systems in ...