IC manufacturers have yet to fully optimize the high-volume manufacturing cost structure for the 300mm wafer size. However, the potential per-die cost savings that the larger wafer can provide is ...

Hardest hit are ≤200mm wafer fabs; 70% of closures in Japan and North America. March 26, 2020 -- Over the past decade, the IC industry has been paring down its older capacity as manufacturers have ...

The BlackStar offers versatility in processing various die sizes ... Laser type will depend on wafer material and marking requirements. About Laser Marking of IC Mold Compounds These systems ...