highlights benefits of its BlackStar silicon wafer dicing system for applications in the semiconductor industry. Conventional laser dicing challenges include reducing material losses and reducing ...

CHICAGO, CA, UNITED STATES, October 11, 2024 /EINPresswire / -- The global wafer dicing services market was valued at USD 578.8 million in 2023 and is projected to exceed a valuation of USD 838.9 ...

Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, highlights benefits of ...

Global wafer dicing services market was valued at US$ 578.8 million in 2023 and is projected to exceed valuation of US$ 838.9 million by 2032 at a CAGR of 4.21% during the forecast period 2024–2032.