Dec. 9, 2024 — Computer memory could one day withstand the blazing temperatures in fusion reactors, jet engines, geothermal wells and sweltering planets using a new solid-state memory device ...
Nexperia has brought out a portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB ...
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