The successful bonding of Al2O3 thin films opens up new possibilities for heterogeneous integration and wafer-level packaging in various device applications[2]. Additionally, research into ...

An international research team has sought to apply black silicon (bSi) to develop ultra-thin substrates for applications ... of ultrathin and flexible wafers with lower impurity levels, which ...

Summary The push for compact, efficient electronics is integrating power management directly onto chips, using wide bandgap semiconductors, hybrid bonding, and wafer thinning. This innovation enhances ...