A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

Laser ablation dicing technology is specifically designed for ultra-thin wafer sawing, addressing limitations associated with blade dicing, such as side wall chipping. To achieve optimal laser ...

Thinner (and thus lighter) wafers provide greater power-to-weight ratios, which is an important factor when building satellites for low-earth orbit. NexWafe said it has developed “ultra-thin ...

It also claims that its technology can enable the production of ultra-thin wafers. It has already demonstrated this on its pilot line in Freiburg, Germany. In addition to ultra-thin wafers ...

Delhi Legislative Assembly Elections are just around the corner with voting set to take place on February 5, 2025. Everyone ...

Their findings can be found in the paper “Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers,” published in Engineering Fracture Mechanics.