RRP Electronics Limited, backed by Sachin Tendulkar, partners with US-based Deca Technologies to enhance its semiconductor capabilities. The collaboration aims to integrate Deca’s innovative packaging ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

Sachin Tendulkar-backed RRP Electronics partners with Deca Technologies to enhance semiconductor capabilities and boost India ...

Imec has  demonstrated electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers ...

Chosun Biz and ICSmart report that Samsung Electronics plans to reduce NAND wafer production at its Xi'an factory in China by ...

RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN ...