近来，随着半导体集成度的提高，晶圆厚度变得越来越薄，这当然给“切单”工艺也带来了不少难度。 晶圆切割(Wafer Dicing)的发展历程 前道和后道工序通过各种不同方式的互动而进一步发展：后道工序的进化可以决定晶圆上die单独分离出的六面体小芯片 ...

Global wafer dicing services market was valued at US$ 578.8 million in 2023 and is projected to exceed valuation of US$ 838.9 million by 2032 at a CAGR of 4.21% during the forecast period 2024–2032.

Astute Analytica has released a comprehensive report on the Global Wafer Dicing Services Market, providing an in-depth analysis of its current and future landscape. This market research document ...

CHICAGO, CA, UNITED STATES, October 11, 2024 /EINPresswire / -- The global wafer dicing services <a target=_blank href= ...

ORLANDO, Fla.–(BUSINESS WIRE)–Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...