The solar industry has dragged its heels on the issue of silver-dependence for cell metallization, but China’s Jiangsu ...

Through-silicon vias (TSVs) enable shorter interconnect lengths ... continuous liners and barrier metals are tougher to deposit, and copper plating must be more precisely controlled to ensure reliable ...

Using a process known as mechanical plating or peen plating, he deposits a layer of copper on a PLA print. The results look good, as you can see in the video below. This isn’t electroplating ...

A seed layer is then placed on top of the barrier to enable copper electroplating ... and Intel is tackling that in both standard silicon designs and using new 2D materials.