The solar industry has dragged its heels on the issue of silver-dependence for cell metallization, but China’s Jiangsu ...

Through-silicon vias (TSVs) enable shorter interconnect lengths ... continuous liners and barrier metals are tougher to deposit, and copper plating must be more precisely controlled to ensure reliable ...

A seed layer is then placed on top of the barrier to enable copper electroplating ... and Intel is tackling that in both standard silicon designs and using new 2D materials.

Using a process known as mechanical plating or peen plating, he deposits a layer of copper on a PLA print. The results look good, as you can see in the video below. This isn’t electroplating ...