Description: Accuratus maintains an inventory of standard aluminum nitride substrates for fast delivery requirements. They are stocked in industry standard thicknesses of .025 inches and .040 inches.

Description: These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold ...

Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

If you're one of these people, you've likely come across ceramic coatings. Ceramic coatings are a liquid substance primarily made up of silica dioxide, which is often combined with other chemicals ...

Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If ...

The MFA program in Ceramic Art at Alfred University has a distinguished history as a center of ceramic art innovation, research and education. In our state-of-the-art facility, our funded 2-year ...

We sell different types of products and services to both investment professionals and individual investors. These products and services are usually sold through license agreements or subscriptions ...