To reiterate, AM is an evolving method of depositing layers of material and binding those layers via sintering or chemical ...
Johns Hopkins researchers have leveraged artificial intelligence to uncover faster, more efficient ways to manufacture ...
Learn how the new EOS nickel-based materials like EOS NickelAlloy IN718 API and EOS Nickel NiCP elevate industrial 3D printing performance, benefiting semiconductor manufacturing.
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AI speeds up titanium alloy production with higher strength for submarine manufacturingA Johns Hopkins research team is using AI to enhance titanium alloys, improving strength and production speed for ...
America Makes and the National Center for Defense Manufacturing and Machining announced a new open project call worth a total ...
AM is gaining ground in the semiconductor industry, particularly in the production of tools like manifolds and wafer chucks.
Using AI-driven models, researchers have identified new processing techniques that can improve the speed of production and strength of high-performance titanium alloy parts.
Researchers from the EPFL and the University of Southern Denmark have developed a volumetric 3D printing method based on ...
OPPO has announced the global availability of its Find N5 foldable smartphone featuring additively manufactured titanium ...
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