铜箔

[tóng bó]

汉英

网络释义

例句

释义:
全部全部,clutch goldclutch gold,copper foilcopper foil,CCLCCL,Cu foilCu foil,RCCRCC
类别:全部全部,口语口语,书面语书面语,标题标题,技术技术
来源:全部全部,字典字典,网络网络
难度:全部全部,简单简单,中等中等,难难
1.
Take brass grid and copper foil as current collectors of the electrode, the charge-discharge performances were better than other materials.
通过比较发现，扎孔的铜箔作为集流体材料，性能与铜箔相差无几。
202.119.108.211
2.
a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole.
陶瓷基板两面铜箔构成的线路通过烧结而成的过孔进行互联导通。
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3.
The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied.
研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。
www.chemyq.com
4.
In this thesis, PCB is considered as a multi- lamina material which consists of copper lamina and strengthened resin with glass fiber.
本论文中，考虑PCB板是复合材料的组成包括铜箔与玻璃纤维强化树脂。
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5.
Deburring As drill removes copper a small copper ridge forms around the hole edge.
去毛刺-钻孔后会在铜箔和孔壁上产生粗糙边。
blog.tianya.cn
6.
Is there a general inspection procedure with Drilling accuracy Hole size Hole quantity Hole location and Copper surface appearance defined?
对钻孔精确度；孔径；孔数量；孔位与铜箔表面确认；是否有相应的检验程序？
www.showxiu.com
7.
adoption of the copper foil thickness: copper foil thickness on the circuit conductor density has a significant impact.
拔取的铜箔厚度：铜箔的厚度不不对电路图形的导线密度有着次给感化。
v2basea1.flashcdnline1.com
8.
Refined copper foil, not backed, in thickness less than 0. 07 mm, whether or not coated with resin.
精炼铜箔，未衬，其厚度在0.07公厘以下者，不论是否有树脂涂布。
tdcinfo.sme.net.cn
9.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途，覆铜箔板的制造过程和应用。
www.dictall.com
10.
It includes non- magnetizer basis material covered by copper film, winding covered by copper film and non-magnetizer material{##**$$}{##**$$} board.
它包括覆铜箔板非导磁基材、覆铜箔线圈和非导磁材料板。
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