熔湿

网络释义

1.
wetting
免洗锡膏标准工艺 - 半导体技术的日志 -... ... 印刷图形的塌落( slump) 熔湿( wetting) 焊锡结珠/锡球( beading/balling) ...
lizhikun5310.blog.163.com|基于6个网页

例句

释义:
全部全部,wettingwetting
类别:全部全部,口语口语,书面语书面语,标题标题,技术技术
来源:全部全部,字典字典,网络网络
难度:全部全部,简单简单,中等中等,难难
1.
New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity.
无铅焊锡膏的焊剂化学的新发展可以做到不使用氮气也可得到良好的熔湿性和焊点完整性。
www.kester.com
2.
Since the core flux carries good workability , it is suitable for soldering where fast wetting is required .
由于芯焊剂具有良好的工作特性，使其适合需要快速熔湿的焊接应用。
v2basea1.flashcdnline1.com
3.
Offers good solderability and excellent wettability .
具有良好的可焊性和优异的熔湿性。
v2basea1.flashcdnline1.com
4.
printing (for 48hours with the same cream) . , printability and solder ability after long time printing shall be same as initial stage.
由于连续印刷性优异，在长时间连续印刷后（同一锡膏48小时），其熔湿性亦可维持和初期一样。
dict.kekenet.com
5.
Superior wetting performance with lower flux splatter.
优异的熔湿特性，溅污影响更低。
www.kester.com
6.
Nitrogen like in the tin-lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen.
与锡-铅系统类似，氮气可以使焊点更为光滑；使用氮气还可以得到更好的熔湿性。
www.kester.com
7.
This will result in slower wetting and reduced hole fill.
这会导致熔湿速度减慢，孔隙填充能力降低。
www.kester.com
8.
Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase.
诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。
www.kester.com